Mendeley | Further Information

{"title"=>"Inferential Structure Determination of Chromosomes from Single-Cell Hi-C Data", "type"=>"journal", "authors"=>[{"first_name"=>"Simeon", "last_name"=>"Carstens", "scopus_author_id"=>"55489103700"}, {"first_name"=>"Michael", "last_name"=>"Nilges", "scopus_author_id"=>"7006940093"}, {"first_name"=>"Michael", "last_name"=>"Habeck", "scopus_author_id"=>"7005882876"}], "year"=>2016, "source"=>"PLoS Computational Biology", "identifiers"=>{"sgr"=>"85007553283", "doi"=>"10.1371/journal.pcbi.1005292", "isbn"=>"1111111111", "pmid"=>"28027298", "issn"=>"15537358", "scopus"=>"2-s2.0-85007553283", "pui"=>"613954242"}, "id"=>"c355c570-8692-33a0-b407-b2c05b6b6ff9", "abstract"=>"Author Summary Spatial interactions between distant genomic regions are of fundamental importance in gene regulation and other nuclear processes. Recent chromatin crosslinking (“Hi-C”) experiments probe the spatial organization of chromosomes on a genome-wide scale to an extent that was previously unattainable. These experiments report on contacting loci and thus provide information about the three-dimensional structure of the genome. Unfortunately, the data are noisy and do not determine the structure uniquely. There is also little quantitative prior knowledge about the large-scale organization of chromosomes. Here, we address these challenges by developing a Bayesian statistical approach that combines a minimalist polymer model with chromosome size measurements and conformation capture data. Our method generates statistical ensembles of chromosome structures from extremely sparse single-cell Hi-C data. We remove potential bias by learning modeling parameters from the experimental data and apply model comparison techniques to investigate which among a set of alternative models is most supported by the Hi-C data. Our method also allows for modeling with ambiguous contact data obtained on polyploid chromosomes, which is an important step towards three-dimensional modeling of whole genomes.", "link"=>"http://www.mendeley.com/research/inferential-structure-determination-chromosomes-singlecell-hic-data-1", "reader_count"=>36, "reader_count_by_academic_status"=>{"Student > Doctoral Student"=>1, "Researcher"=>11, "Student > Ph. D. Student"=>9, "Other"=>5, "Student > Master"=>7, "Professor"=>3}, "reader_count_by_user_role"=>{"Student > Doctoral Student"=>1, "Researcher"=>11, "Student > Ph. D. Student"=>9, "Other"=>5, "Student > Master"=>7, "Professor"=>3}, "reader_count_by_subject_area"=>{"Biochemistry, Genetics and Molecular Biology"=>16, "Agricultural and Biological Sciences"=>15, "Physics and Astronomy"=>2, "Computer Science"=>3}, "reader_count_by_subdiscipline"=>{"Physics and Astronomy"=>{"Physics and Astronomy"=>2}, "Agricultural and Biological Sciences"=>{"Agricultural and Biological Sciences"=>15}, "Computer Science"=>{"Computer Science"=>3}, "Biochemistry, Genetics and Molecular Biology"=>{"Biochemistry, Genetics and Molecular Biology"=>16}}, "reader_count_by_country"=>{"Belgium"=>1, "United States"=>1, "China"=>1, "Italy"=>1, "France"=>1}, "group_count"=>0}

CrossRef

• http://doi.org/10.1126/science.aat5641
• http://doi.org/10.1016/j.commatsci.2019.109178
• http://doi.org/10.1021/acs.jpclett.8b02439
• http://doi.org/10.1016/j.jmb.2019.11.009
• http://doi.org/10.1016/j.sbi.2017.07.001
• http://doi.org/10.1093/bioinformatics/btz181
• http://doi.org/10.1038/s41467-019-10005-6
• http://doi.org/10.1002/wsbm.1435
• http://doi.org/10.1016/j.ymeth.2019.08.008
• http://doi.org/10.1186/s12575-019-0094-0
• http://doi.org/10.1093/nar/gky065
• http://doi.org/10.1038/s41598-019-41369-w
• http://doi.org/10.1016/j.cell.2019.01.020
• http://doi.org/10.3389/fmolb.2017.00015

Scopus | Further Information

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• {"unique-ip"=>"14", "full-text"=>"8", "pdf"=>"2", "scanned-summary"=>"0", "scanned-page-browse"=>"0", "figure"=>"0", "supp-data"=>"8", "cited-by"=>"0", "year"=>"2018", "month"=>"7"}
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• {"unique-ip"=>"10", "full-text"=>"12", "pdf"=>"2", "scanned-summary"=>"0", "scanned-page-browse"=>"0", "figure"=>"0", "supp-data"=>"0", "cited-by"=>"0", "year"=>"2018", "month"=>"9"}
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• {"unique-ip"=>"4", "full-text"=>"5", "pdf"=>"1", "scanned-summary"=>"0", "scanned-page-browse"=>"0", "figure"=>"0", "supp-data"=>"17", "cited-by"=>"0", "year"=>"2018", "month"=>"11"}
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• {"unique-ip"=>"16", "full-text"=>"14", "pdf"=>"4", "scanned-summary"=>"0", "scanned-page-browse"=>"0", "figure"=>"0", "supp-data"=>"0", "cited-by"=>"0", "year"=>"2019", "month"=>"12"}

F1000Prime | Further Information

• {"year"=>2017, "month"=>2, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"http://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-02-27T09:41:24Z"}
• {"year"=>2017, "month"=>3, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"http://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-03-27T08:41:20Z"}
• {"year"=>2017, "month"=>4, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"http://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-04-24T08:41:17Z"}
• {"year"=>2017, "month"=>5, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"http://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-05-29T08:41:16Z"}
• {"year"=>2017, "month"=>6, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"http://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-06-26T08:41:22Z"}
• {"year"=>2017, "month"=>7, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-07-31T08:41:25Z"}
• {"year"=>2017, "month"=>8, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-08-28T08:41:22Z"}
• {"year"=>2017, "month"=>9, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-09-25T08:41:28Z"}
• {"year"=>2017, "month"=>10, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-10-30T08:41:47Z"}
• {"year"=>2017, "month"=>11, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-11-27T09:41:29Z"}
• {"year"=>2017, "month"=>12, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2017-12-25T09:41:22Z"}
• {"year"=>2018, "month"=>1, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-01-29T09:41:07Z"}
• {"year"=>2018, "month"=>2, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-02-26T09:41:07Z"}
• {"year"=>2018, "month"=>3, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-03-26T08:41:11Z"}
• {"year"=>2018, "month"=>4, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-04-30T08:41:06Z"}
• {"year"=>2018, "month"=>5, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-05-28T08:41:08Z"}
• {"year"=>2018, "month"=>6, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-06-25T08:41:09Z"}
• {"year"=>2018, "month"=>7, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-07-30T08:41:18Z"}
• {"year"=>2018, "month"=>8, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-08-27T08:41:33Z"}
• {"year"=>2018, "month"=>9, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-09-24T08:41:21Z"}
• {"year"=>2018, "month"=>10, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-10-29T08:41:27Z"}
• {"year"=>2018, "month"=>11, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-11-26T09:41:25Z"}
• {"year"=>2018, "month"=>12, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2018-12-31T09:41:37Z"}
• {"year"=>2019, "month"=>1, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-01-28T09:41:25Z"}
• {"year"=>2019, "month"=>2, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-02-25T09:41:18Z"}
• {"year"=>2019, "month"=>3, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-03-25T08:41:13Z"}
• {"year"=>2019, "month"=>4, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-04-29T08:41:22Z"}
• {"year"=>2019, "month"=>5, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-05-27T08:41:35Z"}
• {"year"=>2019, "month"=>6, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-06-24T08:41:22Z"}
• {"year"=>2019, "month"=>7, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-07-29T08:41:48Z"}
• {"year"=>2019, "month"=>8, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-08-26T08:41:32Z"}
• {"year"=>2019, "month"=>9, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-09-30T08:41:29Z"}
• {"year"=>2019, "month"=>10, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-10-28T08:41:32Z"}
• {"year"=>2019, "month"=>11, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-11-25T09:41:46Z"}
• {"year"=>2019, "month"=>12, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2019-12-30T09:41:59Z"}
• {"year"=>2020, "month"=>1, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2020-01-27T09:41:24Z"}
• {"year"=>2020, "month"=>2, "doi"=>"10.1371/journal.pcbi.1005292", "f1000_id"=>"727146656", "url"=>"https://f1000.com/prime/727146656", "score"=>2, "classifications"=>["technical_advance"], "updated_at"=>"2020-02-10T09:41:25Z"}